Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net

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  • Original PriceUS$5.06piece
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  • Discount PriceUS$5.06piece
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Shopping for a Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net with cheapest price? Read about features, types, and other must-know topics in our Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net buying guide to make an informed choice. Order finest Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net Look for the Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net package that is finest for you. Make a price comparison, discount promo, or free shipping before shopping.

Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 8 Plus, 8
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 8/8P
Details pictures:


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net


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