Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net
  • Sellerpcextremist.us
  • List PriceUS$4.86piece
  • Sale PriceUS$4.86piece
  • ShippingFree Shipping
  • Ratings3,3 (965)

Product Description

Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 6s/6SP
Details pictures:


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net

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